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Products and Application

Apex comes from the first two letters of approach and excellence. The chairman of Apex, thinks that perfect is difficult and our goal shall to approach excellence.

Technology Item
Current Process Capability
On-going Development
Layer Count 2~20 Layers 20~30 Layers
Min. Finished Hole Size 0.15 mm 0.10 mm
Max. Aspect Ratio 10 : 1 16 : 1
Min. Board Thickness (Final) 0.45 mm 0.30 mm
Max. Board Thickness (Final) 3.0 mm 3.6 mm
Min. Core Thickness 0.05 mm (Exclude Copper) 0.05 mm (Exclude Copper)
Min. Copper Thickness 0.5 oz 0.33 oz
Max. Copper Thickness 3 oz 5 oz
Min. Internal Layer Trace/Space 0.065 /0.065 mm(2.5/2.5 mil) 0.05 / 0.05 mm (2.0/2.0 mil)
Min Outer Layer Trace/Space 0.065 / 0.065 mm(2.5/2.5 mil) 0.05 / 0.05 mm (2.0/2.0 mil)
Min SMD Size 0.175 mm (7 mil) 0.15 mm (6 mil)
Min. SMD Pitch 0.4 mm (16 mil) 0.3 mm (12 mil)
Hole Registration Tolerance 0.075 mm 0.05 mm
Image Registration Tolerance 0.037 mm 0.037 mm
Solder Mask Registration Tolerance 0.037 mm 0.037 mm
Min. Solder Dam 3 mil (0.075 mm) 2 mil (0.05 mm)
Impedance Control 10% 8%
Blind Hole and Bury Hole Yes Yes
PCB Warp and Twist 0.50% 0.50%
HDI Sequence build up process Yes Up to build up 3
Back drilling process Yes Yes

Material Capability

Technology Item
Current Process Capability
On-going Development
FR-4 Yes Yes
CEM-3 Yes Yes
Halogen Free FR-4 Yes Yes
CAF Resistant Laminate Yes Yes
Rogers Yes Yes
Solder Mask (Normal) Yes Yes
Solder Mask (Halogen Free) Yes Yes
Lead Free FR-4 Yes Yes

Final Coating Capability

Technology Item
Current Process Capability
On-going Development
OSP Yes Yes
Immersion Silver Yes Yes
Carbon Ink Yes Yes
HALF Yes Yes
Immersion Tin Yes Yes
ENIG Yes Yes
Resin Plug Yes Yes
VIPPO Yes Yes
Gold finger Yes Yes